Command Reference Library: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
|||
| Line 25: | Line 25: | ||
* [[Plot3dCommand|plot3d]] | * [[Plot3dCommand|plot3d]] | ||
* [[ChartCommand|chart]] | * [[ChartCommand|chart]] | ||
==Alagator Commands== | |||
*[[pdbCommands | pdb]] These control the access and values in the parameter data base. | |||
*[[materCommand | mater]] Control the materials and their names | |||
*[[solutionCommand | solution]] Create and control solutions | |||
==Application Specific Commands== | ==Application Specific Commands== | ||
| Line 47: | Line 52: | ||
*[[profileCommand | profile]] This allows the reading in of a one-dimensional profile | *[[profileCommand | profile]] This allows the reading in of a one-dimensional profile | ||
*[[mathCommand | math]] Controls the numerical analysis options - not for the faint hearted | *[[mathCommand | math]] Controls the numerical analysis options - not for the faint hearted | ||
Revision as of 19:20, 18 June 2020
Command Conventions
Some basic ideas on how commands work and are used.
Grid Commands
Commands to control grid generation and refinement.
- fs creating and control of new fieldservers - expert use only!
- line - Controls placement of gridlines for rectilinear meshes
- region - Allows rectangular materials to be created
- init - Initializes the grid structure from rectangular commands or a saved file
- struct - Allows the grid and solution values to be saved or read from a file
- Smooth - smooths the grid and attempts to make equilaterial elements
- grid - access to many grid information / manipulation actions
Post Processing Commands
Commands to analyze data.
Most common post processing commands:
Alagator Commands
- pdb These control the access and values in the parameter data base.
- mater Control the materials and their names
- solution Create and control solutions
Application Specific Commands
Commands to solve systems of equations, deposit materials, and more!
Process Commands
- deposit The deposit command allows new material to be deposited on the wafer surface. This command is all new for the 2002 release.
- diffuse Simulate all types of thermal steps, including anneals, oxidations, and silicidations.
- rta This is a simplified interface to the diffuse command and temperature ramps for rta anneals.
- etch This command is used with a specific etch to evolve the surface according to the type of etching specified.
- furnace This is a simplified interface to the diffuse command for furnace anneals.
- implant Implant a dopant and add it to the existing distributions.
- mask This command is used to create a mask. It can be used subsequently with an implant or etch command..
- strip This command removes a specified surface material in its entirety.
Device Commands
- contact This command allows contacts to be added to an existing structure. It can also be used to fetch contact information - like current.
- device This is the main simulation command and supports DC, AC, and noise analysis.
Other Commands
Miscellaneous commands that aren't really categorizable. There are many useful commands here!