Command Reference Library: Difference between revisions
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Most common post processing commands: | Most common post processing commands: | ||
* [[SelectCommand|select]] | * [[SelectCommand|select]] | ||
* [[Plot.1dCommand| | * [[WindowCommand|window]] | ||
* [[Plot.2dCommand| | * [[PenCommand|pen]] | ||
* [[ | * [[Plot.1dCommand|plot1d]] | ||
* [[Plot.2dCommand|plot2d]] | |||
* [[Plot3dCommand|plot3d]] | |||
* [[ChartCommand|chart]] | |||
==Alagator== | |||
===Alagator Starting Place and Tutorial=== | |||
Alagator is the scripting language that was developed as a way for FLOOXS users to easily control the physics in their simulations. This is where the real power of FLOOXS lies. These commands allow the user to easily set up a set of common process or semiconductor device equations. For example, the scripting language has multiple components that are called during the execution of a diffusion command. The basic element is a description of a differential equation. | |||
* [[Alagator Language Description]], A description of the recognized keywords and symbols in building an equation. | |||
* [[Alagator Tutorial]], Tutorial examples that help users get started. | |||
===Alagator Commands=== | |||
*[[pdbCommands | pdb]] These control the access and values in the parameter database. | |||
*[[materCommand | mater]] Control the materials and their names | |||
*[[solutionCommand | solution]] Create and control solutions | |||
==Application Specific Commands== | ==Application Specific Commands== | ||
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*[[DepositCommand | deposit]] The deposit command allows new material to be deposited on the wafer surface. This command is all new for the 2002 release. | *[[DepositCommand | deposit]] The deposit command allows new material to be deposited on the wafer surface. This command is all new for the 2002 release. | ||
*[[Diffuse Command | diffuse]] Simulate all types of thermal steps, including anneals, oxidations, and silicidations. | *[[Diffuse Command | diffuse]] Simulate all types of thermal steps, including anneals, oxidations, and silicidations. | ||
*[[Rta_Command | rta]] This is a simplified interface to the diffuse command and temperature ramps for rta anneals. | |||
*[[Etch Command | etch]] This command is used with a specific etch to evolve the surface according to the type of etching specified. | *[[Etch Command | etch]] This command is used with a specific etch to evolve the surface according to the type of etching specified. | ||
*[[Furnace Command | furnace]] This is a simplified interface to the diffuse command for furnace anneals. | *[[Furnace Command | furnace]] This is a simplified interface to the diffuse command for furnace anneals. | ||
*[[Implant Command | implant]] Implant a dopant and add it to the existing distributions. | *[[Implant Command | implant]] Implant a dopant and add it to the existing distributions. | ||
*[[Mask Command | mask]] This command is used to create a mask. It can be used subsequently with an implant or etch command.. | *[[Mask Command | mask]] This command is used to create a mask. It can be used subsequently with an implant or etch command.. | ||
*[[Strip Command | strip]] This command removes a specified surface material in its entirety. | *[[Strip Command | strip]] This command removes a specified surface material in its entirety. | ||
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*[[profileCommand | profile]] This allows the reading in of a one-dimensional profile | *[[profileCommand | profile]] This allows the reading in of a one-dimensional profile | ||
*[[mathCommand | math]] Controls the numerical analysis options - not for the faint hearted | *[[mathCommand | math]] Controls the numerical analysis options - not for the faint hearted | ||
Latest revision as of 19:48, 18 June 2020
Command Conventions
Some basic ideas on how commands work and are used.
Grid Commands
Commands to control grid generation and refinement.
- fs creating and control of new fieldservers - expert use only!
- line - Controls placement of gridlines for rectilinear meshes
- region - Allows rectangular materials to be created
- init - Initializes the grid structure from rectangular commands or a saved file
- struct - Allows the grid and solution values to be saved or read from a file
- Smooth - smooths the grid and attempts to make equilaterial elements
- grid - access to many grid information / manipulation actions
Post Processing Commands
Commands to analyze data.
Most common post processing commands:
Alagator
Alagator Starting Place and Tutorial
Alagator is the scripting language that was developed as a way for FLOOXS users to easily control the physics in their simulations. This is where the real power of FLOOXS lies. These commands allow the user to easily set up a set of common process or semiconductor device equations. For example, the scripting language has multiple components that are called during the execution of a diffusion command. The basic element is a description of a differential equation.
- Alagator Language Description, A description of the recognized keywords and symbols in building an equation.
- Alagator Tutorial, Tutorial examples that help users get started.
Alagator Commands
- pdb These control the access and values in the parameter database.
- mater Control the materials and their names
- solution Create and control solutions
Application Specific Commands
Commands to solve systems of equations, deposit materials, and more!
Process Commands
- deposit The deposit command allows new material to be deposited on the wafer surface. This command is all new for the 2002 release.
- diffuse Simulate all types of thermal steps, including anneals, oxidations, and silicidations.
- rta This is a simplified interface to the diffuse command and temperature ramps for rta anneals.
- etch This command is used with a specific etch to evolve the surface according to the type of etching specified.
- furnace This is a simplified interface to the diffuse command for furnace anneals.
- implant Implant a dopant and add it to the existing distributions.
- mask This command is used to create a mask. It can be used subsequently with an implant or etch command..
- strip This command removes a specified surface material in its entirety.
Device Commands
- contact This command allows contacts to be added to an existing structure. It can also be used to fetch contact information - like current.
- device This is the main simulation command and supports DC, AC, and noise analysis.
Other Commands
Miscellaneous commands that aren't really categorizable. There are many useful commands here!